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| 发布时间：2010.07.29 |
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摘要： 爆板也叫分层，是PCB制造与装配一个常见问题，在有铅焊接也经常出现，涉及影响因素很多，板材，PCB制造过程和装配过程都存在一定影响因素。目前，业界已普遍采用无铅焊接，爆板问题更为突出。如何防范该问题的发生，必须从各个环节进行预防与改善。本文根据日常经验进行整理，供大家参考。
关键词：无铅焊接 爆板 应力 粘结强度 耐热性
Abstract：Delamination is a common problem during PCB assembly process even for tin lead assembly, many factors including the raw material, PCB manufacturing process and the soldering process might cause delamination. Nowadays, it’s more critical as lead free soldering become more and more popular , how to prevent and improve the related process? How to better understand the problem, for your good reference. this article we collect and summarize some information according to our experience
Keywords：Lead free soldering Delamination Stress Bonding strength Heat resistance |
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